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An investigation onmechanical properties of tin-silver-copper and tin-silver lead-free solder sphere used in FCPBGA electronic packages
by WONG TZU LING
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| Item type | Location | Call Number | Status | Date Due |
|---|---|---|---|---|
 THESIS (MASTER) |
Pusat Sumber FKAB | FKAB/JKEES/T00026/2012 Ma (Browse Shelf) | Not for loan |
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